Long time stability,high speed printing,4-7.5 um fingers,mass production
Customized for SE and non-SE process for high shect.reistance emitter
Robust contact designed for Various firing process Good EL for low laydown or low firing temperature
Self desisned raw materials & formula,well. Balanced between eff & reliability
Suitable for varioes sintering furnace,light ingectlom & leser indued firing furnace
Well-balanced Voc and FF performance for higher conversion efficiency.
Robust firing window design, maintaining excellent IV, EL and reliability performance atlow laydown and low firing temperatures
Compatible with LP, PE, PVD and other Poly deposition routes, with customized solutions for different poly thicknesses and wafer structures
Adaptable to wafers with or without Al₂O₃ backside passivation layers
Suitable for ultra-fine line printing, supporting finger patterns down to 10μm
Both standard and low-solid-content formulations available to support customers' cost reduction and efficiency improvement goals
Fast drying capability with no powder shedding during friction tests before and after firing
Fully compatible with laser-enhanced contact optimization technology, further improving conversion efficiency and matching front-side processes to reduce EL defect
