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XBC Cell

XBC Cell

The disruptive full-back contact design hides electrodes on the back of the cell, achieving an ultimate appearance with zero front-side obstruction and higher energy absorption efficiency. This gridless aesthetic makes it particularly suitable for distributed photovoltaics and high-end building integration scenarios, maintaining stable output under complex lighting conditions and representing the highest level of precision manufacturing for photovoltaic cells.

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XBC N-region Ag pastes
GD71

Application Scenarios:

Applicable to back-contact structure of N-type silicon substrate, featuring superior ohmic contact with poly-Si layer.

Printing Stencils:

PI knotless screen with ultra fine line finger pattern

Highlights:

Precisely activate Poly surface to form silver microcrystal contacts and build low-resistance conductive paths.

Broad firing window and excellent reliability, effectively improving cell conversion efficiency and long-term stability.

Combines excellent printing rheology and adapts to fine-line printing for BC cells.

Low silver consumption reduces cost, balancing mass production yield and economic efficiency.

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