1.Wider sintering window (720-790°C);
2.Excellent tensile and aging tensile strength, wide welding window;
3.Ultra-low consumption, low series resistance, minimal passivation layer damage, low impurity recombination;
4.Suitable for multiple processes: single-sided, double-sided, MBB cells;
5.Compatible with high-speed printing of 166-210 size cells.
1.High-speed printing capability with ultra-fine line stencils;
2.Excellent electrical performance efficiency;
3.Wide sintering window, excellent EL performance at low consumption and low temperature;
4.Suitable for a wide range of sheet resistances;
5.Suitable for fast printing of 166-210 size cell sheets.
Adapted to N-TOPCon B-doped emitter, conventional firing and LIF laser process.We can also customize targeted paste formulas according to customer requirements, suitable for high-speed printing and various screen mesh parameters.
Less damage on passivation layer better Uoc and FF
Reliable and robust soldering window for module process
Own patented silver powders for better printability of busbar connecting lines
